Design to Silicon: A Deep Dive into Tapeout, GDS-II, and Mask Set
in the intricate journey of semiconductor fabrication, the transition from a digital design to a physical chip involves several critical stages. Among these, Tapeout, GDS-II, and Mask Set play pivotal roles in ensuring that the final product accurately reflects the intended design. Let’s delve into each of these components with technical precision.
https://bitsilica.com/from-des....ign-to-silicon-a-dee

Powering the Next Generation of High-Performance Computing and AI Infrastructure
As we advance into an era dominated by artificial intelligence (AI), machine learning (ML), and data-intensive applications, the demand for faster and more efficient data transfer mechanisms has never been greater. Enter PCI Express 7.0 (PCIe 7., the latest iteration of the PCIe standard, poised to revolutionize data interconnectivity in high-performance computing environments.The exponential growth in AI model complexity necessitates rapid data movement between processors, accelerators, and memory. PCIe 7.0 addresses this by providing ultra-low laten

BITSILICA is at the forefront of transforming the semiconductor industry with innovative design services that span VLSI, embedded systems, and AI-driven solutions. With a global presence and a team of over 500 skilled engineers, BITSILICA delivers end-to-end semiconductor expertise—from ASIC and SoC design to FPGA development and physical design. Specializing in high-performance technologies for data centers, 5G, IoT, and automotive applications, BITSILICA partners with industry leaders like AMD and Samsung to power the next generation of cutting-edge solutions worldwide.