MARKET OVERVIEW:

The advanced IC substrate market, valued at USD 10.58 billion in 2024, is expected to grow to USD 17.26 billion by 2033, reflecting a CAGR of 5.31%. This market growth is driven by the rising demand for high-performance electronic devices, miniaturization, and the growing number of data centers. Additionally, the need for energy-efficient and compact devices, along with technological advancements, are key factors propelling the market forward.

STUDY ASSUMPTION YEARS:

• BASE YEAR: 2024
• HISTORICAL YEAR: 2019-2024
• FORECAST YEAR: 2025-2033

ADVANCED IC SUBSTRATE MARKET KEY TAKEAWAYS:

• Global market size in 2024: USD 10.58 billion, forecasted to reach USD 17.26 billion by 2033 with a CAGR of 5.31%.
• Strong demand for advanced electronic devices, such as smartphones, PCs, and wearables.
• Increasing popularity of miniaturization is boosting the adoption of compact and energy-efficient devices.
• Growing number of data centers worldwide is driving the need for advanced IC substrates.
• Technological innovations in semiconductor packaging, like flip-chip and wafer-level packaging, are key growth factors.

MARKET GROWTH FACTORS:

Technological Advancements:

The market is boosting breakthroughs in semiconductor packaging technologies such as fan-out wafer-level packaging and flip-chip technology. These advancements allow the creation of substrates with optimized electrical pathways, which will provide increasingly better efficiencies in devices such as smartphones and wearable technology.

Miniaturization Demand:

Consumer demand for smaller, lighter, and energy-efficient devices is now pushing the market for advanced IC substrates, which are designed to allow the integration of multiple components into modules that would otherwise be impossible within such a small footprint without violating any of the primary functions.

Data Center Growth:

Increased data center and cloud computing services act as a major driver associated with it. Critical advanced IC substrates possessing heat management mechanisms are necessary for reliable performance and efficiency under the high-strung environment of data centers in processing vast amounts of information securely and efficiently.

MARKET SEGMENTATION:

• By Type:
  • Organic Substrates: Used for high-density interconnects in advanced electronic devices.
  • Ceramic Substrates: Known for their thermal stability and strength in demanding applications.
  • High-Density Interconnect (HDI) Substrates: Provide better performance in high-speed devices.
• By Application:
  • Consumer Electronics: Includes smartphones, laptops, wearables, etc.
  • Automotive Electronics: Used in vehicles for advanced driver-assistance systems and infotainment.
  • Telecommunications: Enabling 5G and next-gen networks.
  • Computing Devices: Used in high-performance computing for servers and data centers.
• Breakup by Region:
  • Asia Pacific: Dominates the market, driven by demand in consumer electronics and data centers.
  • North America: Strong growth due to high technology adoption and government initiatives.
  • Europe: A growing market for automotive and industrial electronics.
  • Rest of the World: Emerging markets contributing to the global growth.

REGIONAL INSIGHTS:

Asia Pacific will dominate the advanced IC substrate market in 2024 as it has the strongest demand from consumer electronics as well as from data centers and semiconductor manufacturing. New technological development is driving the market growth along with the fact that this area is responsible for the electronics industry manufacturing.

RECENT DEVELOPMENTS NEWS:

Latest development with regard to Onto Innovation is opening Packaging Applications Center of Excellence in Singapore. The program intends to advance semiconductor packaging and substrate manufacturing technologies targeting high-performance devices for crucial markets such as AI, 5G, and automotive electronics.

KEY PLAYERS:

• ASE Group
• AT S Austria Technologie Systemtechnik Aktiengesellschaft
• Fujitsu Limited
• Ibiden Co. Ltd.
• JCET Group Co. Ltd
• Kinsus Interconnect Technology Corp.
• Korea Circuit Co. Ltd.
• KYOCERA Corporation
• LG Innotek Co. Ltd.
• Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)
• TTM Technologies Inc.
• Unimicron Technology Corporation (United Microelectronics Corporation)

If you require any specific information that is not covered currently within the scope of the report, we will provide the same as a part of the customization.

About Us:

IMARC Group is a global management consulting firm that helps the world’s most ambitious changemakers to create a lasting impact. The company provide a comprehensive suite of market entry and expansion services. IMARC offerings include thorough market assessment, feasibility studies, company incorporation assistance, factory setup support, regulatory approvals and licensing navigation, branding, marketing and sales strategies, competitive landscape and benchmarking analyses, pricing and cost research, and procurement research.